CyberC 2022(IEEE TCCC)征稿: 第14届网络分布式计算与知识发现国际会议

Call for papers

The 14th Int. Conference on Cyber-Enabled Distributed Computing and Knowledge Discovery

Suzhou, China, November 17 - 18, 2022

Sponsor: IEEE TCCC 

(https://cs-tccc.org/)

Web: www.Cyberc.org

Publication: IEEE (EI & Explore)

Submission deadline: Sep. 10, 2022

Paper Submission:

Submission via EDAS https://edas.info/N26997 or submit paper to Papers@CyberC.org

2022 Theme: Cyber Computing of AI/ML, Cybersecurity, Image Processing, and Beyond 5G

Organizer: Xi’an Jiaotong-Liverpool University

Co-hosted by: Nanjing University of Posts & Telecommunications, Zhengzhou University, Guangzhou University

Financially Sponsored by: Huawei, ZTE, Xi’an Jiaotong-Liverpool University

Scopes: CyberC promotes in-depth exploration of the most recent research and developments in the fields of AI, big data, distributed computing, clouds, cybersecurity, Blockchain, image computing, mobile computing, Internet of Things, and other cyber-based technologies. Professors, scientists, engineers, and students in these areas are encouraged to participate. CyberC welcomes industrial participation.  

Summit: CyberC 2022 co-hosts Emerging Technology Summit (AI, Blockchain, Big Data, Image, 6G) forum that emphasizes innovative and state-of-art R&D, industry products, specifications, showcases, tutorials, technical transitions, and markets.

Co-hosted Workshops

• Big Data & AI: The 10th International Workshop on Big Data and Artificial Intelligence, 2022

• Cybersecurity & Blockchain: The 10th workshop on Cyber Security and Privacy, 2022

• Cyber Image: The 3rd International Workshop Cyber Image, 2022

INFORMATION FOR AUTHORS

The CyberC 2022 Proceedings will be published by IEEE CPS. Full papers for CyberC 2022 must not exceed 10 pages of IEEE2-column format, while short papers must not exceed 4 pages. Please visit the conference website at 

http://www.cyberc.org for precise formatting and submission instructions.

IMPORTANT DATES

Submission deadline for full (10-page) and/or short (4-page) papers: September. 10, 2022

Notification of acceptance: October 20, 2022

Registration and Camera-ready: November 1, 2022

SPECIAL ISSUE

CyberC 2022 provides a special channel for authors to submit their extended version to Journal of Sensors by MDPI. After submission of a CyberC version, you can submit an extended version to the Journal before December 30, 2022. 

http://cyberc.org/Callforpapers/SpecialIssue

CyberC PROCEEDING (ACCEPTED PAPERS) 

EI, IEEE Xplore, Google Scholar, Scopus, DBLP

HONORABLE CO-CHAIRS

David Lu, AT&T, USA

Eng Gee Lim, Xi'an Jiaotong-Liverpool University, China

GENERAL CO-CHAIRS

Chih-Lin I, China Mobile, China

Angelos Stefanidis, Xi'an Jiaotong-Liverpool University, China

SUMMIT/KEYNOTE CO-CHAIRS

Chi-Ming Chen, AT&T Labs, USA

Lejun Zhang, Guangzhou University, China

Jionglong Su, Xi'an Jiaotong-Liverpool University

STEERING COMMITTEE

Anup Kumar (Chair), University of Louisville, USA

Suryadip Chakraborty, Johnson C. Smith Univ., USA

Chi-Ming Chen, AT&T Labs, USA

Chih-Lin I, China Mobile, China

Yang Yang, ShanghaiTech, China

Jiangzhou Wang, University of Kent, UK

Tzyh-Jong (TJ) Wang, AT&T Labs, USA

TECHNICAL PROGRAM COMMITTEE

See www.cyberc.org

AUTHOR CONTACTS

Email: papers@cyberc.org

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